The Failure of a Novel Solid MEMS Switch under High Impact

Chuanqin Liu; Ying Wang; Fufu Wang

doi:10.6180/jase.2014.17.2.02

The Failure of a Novel Solid MEMS Switch under High Impact

Chuanqin Liu¹, Ying Wang This email address is being protected from spambots. You need JavaScript enabled to view it.² and Fufu Wang³

¹Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, P.R. China
²Beijing Zhong Ke San Huan Hi-Tech Co., Ltd., Beijing 100190, P.R. China
³State Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, Beijing 100081, P.R. China

Received: May 22, 2013
Accepted: March 5, 2014
Publication Date: June 1, 2014

Download Citation: ||https://doi.org/10.6180/jase.2014.17.2.02

ABSTRACT

This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact and the influence of some factors such as the current and thermal on the leads by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.

Keywords: High Impact, Simulation, The Novel Solid MEMS Switch, Leads, Reliability

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