16×2 Thermally Actuating and Sensing Probe Array

Ching Hsiang  Tsai; Chao Chiun Liang; Gen Wen Hsieh; Wei-Chih  Lin; Yuh Wen Lee

doi:10.6180/jase.2004.7.2.12

16×2 Thermally Actuating and Sensing Probe Array

Electro-Mechanical Engineering

Ching Hsiang Tsai ¹, Chao Chiun Liang¹, Gen Wen Hsieh¹, Wei-Chih Lin¹ and Yuh Wen Lee¹

¹Electronics Research & Service Organization Industrial Technology Research Institute Jhudong, Taiwan 310, R.O.C.

Received: January 15, 2004
Accepted: March 5, 2004
Publication Date: June 1, 2004

Download Citation: ||https://doi.org/10.6180/jase.2004.7.2.12

ABSTRACT

This paper developed an active scanning probe array. The probe array consists of 16×2 probes thermally actuating and sensing. The 32 probes are integrated with Ti/Pt temperature sensors and bimorph thermal actuators. Each probe is a Si₃N₄ cantilever equipped with a sharp nano scale pyramid tip at its free end. When one of the probes is actuated, its neighboring probes can provide temperature sensing feedback. The temperature coefficient of resistance (TCR) of the embedded Ti/Pt sensor of each probe is 2100 ppm °C ^-1 , and the micro thermal actuator shows good reliability after 500 cycles over specification continuous actuating test.

Keywords: Scanning Probe Microscope, Thermal Actuator Integrated Probe Array

REFERENCES

[1] Mamin, H. J. and Quate, C. F., Sensors and Actuators A, Vol. 48, pp. 215-219 (1995).
[2] Minne, S. C., Yaralioglu, G. , Manalis, S. R., Adams, J. D., Zesch, J., Atalar, A. and Quate, C. F., Applied Physics Letters A, Vol. 72, pp. 2340-2342 (1998).
[3] Lutwyche, M., Andreoli, C., Binnig, G. , Brugger, J., Drechsler, U., Haberle, W., Rohrer, H., Rothuizen, H., Vettiger, P., Yaralioglu, G. and Quate, C., Sensors and Actuator A, Vol. 73, pp. 89-94 (1999).
[4] Wilder, K. and Quate, C. F., J. Vac. Sci. Technol. B, Vol. 17, pp. 3256-3261 (1999).
[5] Grow, R. J., Minne, S. C., Manalis, S. R. and Quate, C. F., J. MEMS, Vol. 11, pp. 317-321 (2002).
[6] Vettiger, P., Brugger, J., Despont, M., Drechlser, U., Durig, U., Haberle, W., Lutwyche, M., Rothuizen, H., Stutz, R., Widmer, R. and Binnig, G. , Microelectronic Engineering, Vol. 46, pp. 11-17 (1999).
[7] Lee, D. W., Ono, T., Abe, T. and Esashi, M., J. MEMS, Vol. 11, pp. 215-221 (2002).
[8] Eleftheriou, E., Antonakopoulos, T., Ninnig, G. K., Cherubini, G. , Despont, M. and Dholakia, A., IEEE Transactions on Magnetics, Vol. 39, pp. 938-945 (2003).