Yu-Tang Chen1 , Shung-Wen Kang This email address is being protected from spambots. You need JavaScript enabled to view it.2, Chin-Chun Hsu2 and Jun-Wei Lin2
1Department of Mechanical Engineering, De Lin Institute of Technology, Tuchen, Taiwan 236, R.O.C. 2Department of Mechanical and Electro-Mechanical Engineering, Tamkang University, Tamsui, Taiwan 251, R.O.C.
Received: March 8, 2007 Accepted: March 31, 2007 Publication Date: June 1, 2007
This paper presents a micro copper fuse developed on a glass epoxy plate using wet etching technology. The fuse structure has a length of 600 μm and a width of 80 μm. The thickness of the copper layer is 30 μm. Numerical simulation was studied with ANSYS software to predict the temperature distribution of the micro fuse with variable input current. Different micro fuse cross sectional areas were obtained by controlling the etching time. The fuse characteristics were evaluated experimentally using input power to the blowing current at 0.1 A increment. Measured temperature showed good agreement with the simulation data. Under safety standard test requirement, the normal rated current of the design micro fuses are 1.15 A, 1.60 A and 2.10 A at an input voltage of 3.6 V.
Keywords: Micro Copper Fuse, Wet Etching, Glass Epoxy Plate, Temperature Distribution, Blowing Current, Safety Standard
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